Musk Claims Suppliers Rush Terafab Chips
The Tesla and SpaceX joint venture says ASML and others are accelerating deliveries, yet experts doubt the massive 2028 production target is realistic.
By Natalia Thornton ·

Elon Musk has asserted that key semiconductor suppliers are fast-tracking equipment deliveries to support the aggressive timeline of Terafab, a joint megaproject between Tesla and SpaceX. However, the announcement comes with significant caveats, as Musk himself described the schedule as "highly aspirational" and carrying "big error bars." This tension between the stated urgency and the acknowledged uncertainty defines the current outlook for the facility, which aims to manufacture one terawatt of AI computing power annually.
During a live broadcast of SpaceX’s Q3 2026 earnings call on October 20, Musk confirmed that the primary facility in Gibbons Creek, Texas, targets volume chip production by the third or fourth quarter of 2028. He expressed appreciation to ASML and other vendors for accelerating their shipments to meet this deadline. Additionally, SpaceX plans to produce its first experimental test chip at its Austin, Texas, research fab around the second quarter of 2027.
The project’s scale relies heavily on specialized partners. Intel joined the venture in April 2026 to co-develop silicon fabrication using its 14A manufacturing node. ASML, the sole commercial supplier of the $400 million extreme ultraviolet (EUV) lithography systems required for leading-edge production, is considered the most critical partner. Unofficial sources previously indicated the first EUV tool was slated for mid-2027 delivery, though it remains unclear if this date has been moved up in line with Musk’s recent comments.
Beyond lithography, the supply chain involves major American and Japanese equipment makers, including Applied Materials, Lam Research, KLA Corporation, and Tokyo Electron. Tesla and SpaceX are also negotiating with approximately ten South Korean firms, such as Hanmi Semiconductor and HPSP, for advanced packaging and process control machinery. These components will enable the facility to fabricate logic, memory, and advanced packaging architectures in a single, vertically integrated location.
The commercial stakes are immense, with Musk claiming that Terafab’s output could rival the GDP of top-20 global countries, a benchmark currently held by Switzerland with a GDP of roughly $1.14 trillion. The chips are intended for xAI clusters, autonomous vehicles, Optimus robots, and SpaceX’s orbital data centers. Skeptics point to Gartner’s estimate that total global AI-optimized data center capacity is only about 44 GW as of late 2026, a mere 4.4% of Terafab’s planned annual output.
Source: Tom's Hardware · original report published





